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It's Not Only Hardware - Software and ESD Knowledge Makes the Difference!

320 mm Automated Test System ATS-8300G

The ATS-8300G test system is a 320 mm fully automated robotic probing solution for TLP, VF-TLP, HBM, HMM and CC-TLP on package- and wafer-level.


HPPI is offering CC-TLP for investigation of CDM from Fraunhofer EMFT. The new CC-TLP probe CC-TLP-50-A1 is operated using the HPPI TLP-3010C/4010C/8010C/12010C systems and software.

What is TLP?

High Current TLP Characterisation: An Effective Tool for the Development of Semiconductor Devices and ESD Protection Solutions

PHD-4001A: High Performance VF-TLP/TLP/HMM Probearm Kit

Extremely compact and robust TLP/VF-TLP/HMM Picoprobe probearm kit for temperature measurements using coaxial cable tunnels for thermo-chuck in isolated chamber temperature measurements for 300 mm probe stations.

CS-0V5-A: 120 A in 150 ps

Pulse current sensor CS-0V5-A with very fast rise time 3 GHz bandwidth. Successor for Tek CT-1/2/6.


New precision wafer-level calibration ceramic substrate for VF-TLP/TLP/HMM/HBM calibration. Size: 24 mm x 24 mm. Probing pitch 50 µm to 3 mm.

1 kV, 10 A, 4 GHz Bias Tee

The BT-101000B is used for DC biased TLP, VF-TLP, HMM or general RF measurements of high voltage and power devices in the time domain or frequency domain.