TLP/VF-TLP/HMM/HBM Calibration Substrate

Features

High quality AlN ceramic substrate for TLP/VF-TLP/HMM/HBM system wafer-level calibration using ground-signal (GS) RF probes
Probetip pitch range from 50 μm up to 3 mm
11 reference resistors in the range of 0.1, 0.2, 0.5, 1, 2, 5, 10, 50, 100, 500 Ω (HBM) and 1 MΩ (SMU) for calibration of the current measurement channel and SMU verification
8 reference Z-diodes in the range of 5, 6.5 (TVS), 8.75 (Low-Cap TVS), 10, 20, 30 (Low-Cap TVS), 68 and 120 V for calibration of the voltage measurement channel
1 capacitor 20 pF / 200 V for transient verification
1 inductor 8 nH for transient verification
6 open-load and 6 short-circuit test-structures
2 timing de-skew landing-pad structures
1 custom reference device position
Rugged NiCr/Au/Ni/Au top metal
Laser marked serial number
Probe pitch verification ruler 100 μm, 200 μm, 300 μm, 400 μm, 500 μm, 600 μm
Size 24 mm x 24 mm (fits on AUX chuck)
Calibration reference data sheet
Protective case

Download: Product Datasheet CAL-04A