The ATS-8300G test system is a 320 mm x 320 mm fully automated probing solution for HBM, TLP, VF-TLP, HMM and CC-TLP on package- and wafer-level.
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ATS-8300G Automated Test System
The ATS-8300G test system is a 320 mm x 320 mm fully automated probing solution for HBM, TLP, VF-TLP, HMM and CC-TLP on package- and wafer-level.
HBM-TS10-A
10 kV ANSI/ESDA/JEDEC HBM Test System
ATS-8300G Automated Test System
The ATS-8300G test system is a 320 mm x 320 mm fully automated probing solution for HBM, TLP, VF-TLP, HMM and CC-TLP on package- and wafer-level.
ATS-8000A Automated Test System
Fully automated test and probing solution for HBM, TLP, HMM and CC-TLP on package- and wafer-level.
CC-TLP
Probe Arm
Software
Accurate Sub-ns Timing
Accurate Calibration
High performance wafer-level calibration substrate for accurate calibration of the VF-TLP/TLP/HMM/HBM system.
Flexible Pitch GND Fixture GF-A
High performance GND clamps for flex-pitch application
TLP-8010C Advanced
80A VF-TLP/TLP, 15kV HMM plus optional 6kV HBM (JEDEC) system. Optional pulse width extender TLP-3011C, TLP-8012A5