CAL-03A

TLP/VF-TLP/HMM/HBM Calibration Substrate

Features

  • High quality ceramic substrate for TLP/VF-TLP/HMM/HBM system wafer-level calibration using ground-signal (GS) RF probes
  • Probetip pitch range from 50 µm up to 3 mm
  • 9 reference resistors in the range of 0.1, 0.2, 0.5, 1, 5, 10, 50, 100 and 500 Ω for calibration of the current measurement channel
  • 8 reference Z-diodes in the range of 5, 6.5 (TVS), 8.75 (Low-Cap TVS), 10, 20, 30, 68 and 120 V for calibration of the voltage measurement channel
  • 6 open-load and 6 short-circuit test-structures
  • 2 timing de-skew landing-pad structures
  • 5 custom reference device positions
  • Rugged top layer metal gold coating
  • Laser marked serial number
  • Probe pitch verification ruler 100 µm, 200 µm, 300 µm, 400 µm, 500 µm, 600 µm
  • Size 24 mm x 24 mm (fits on AUX chuck)
  • Protective case
  • Calibration datasheet

Download: Product Datasheet CAL-03A

TLP/VF-TLP/HMM/HBM Ceramic Calibration Substrate (Size 24 mm x 24 mm)

Protective Case