Ceramic Calibration Substrate on a 8-inch Aluminum Wafer

Features

Ø200 mm x 3 mm thick aluminum carrier disc for convenient handling of the calibration substrate on wafer prober chucks
High quality ceramic substrate for TLP/VF-TLP/HMM/HBM calibration using ground-signal (GS) RF probes
Probetip pitch range from 50 µm up to 3 mm
8 reference resistors in the range of 0.1, 0.2, 0.5, 1, 5, 10, 50 and 100 Ω for calibration of the current measurement channel
5 reference Z-diodes in the range of 5, 7, 10, 18 and 33 V for calibration of the voltage measurement channel. Optional 68 V and 120 V Z-diodes in addition for high voltage calibration applications
1 silicon transient voltage suppressor (TVS) diode for reference measurement of the calibrated TLP/VF-TLP system
45 open-load and 45 short-circuit teststructures
9 (7 on HV option) custom reference device locations
Rugged top layer metal hard gold coating
Calibration datasheet

Download: Product Datasheet 8-inch Calibration Substrate CAL Disc 200 x 3