MPI Corporation
MPI Corporation’s Advanced Semiconductor Test (AST) Division is anchored in three core pillars: 1. Understanding Requirements, 2. Relentless Innovation, and 3. Reducing Cost of Test. These pillars guide our approach in delivering superior solutions for semiconductor testing.
1. Understanding Requirements: Our deep understanding of the semiconductor industry’s evolving needs drives our product development. We specialize in a range of testing solutions, including Manual Probe Stations, Automated Probe Stations, and extensive On-Wafer Testing capabilities. Our expertise extends to specific applications such as RF Probe, DC Probe Stations, RF Probe Stations, and Calibration Substrates.
2. Relentless Innovation: At MPI AST, innovation is continuous. We develop cutting-edge Probe Systems, including GSG, GSGSG, and GSSG Probes, designed for precise Device Characterization, High Power Measurements, and RF and mmWave applications. Our commitment to innovation extends to Design Validation, Failure Analysis, Wafer Reliability, and Silicon Photonics, ensuring we stay at the forefront of technology advancements and Signal Integrity.
3. Reducing Cost of Test: We aim to optimize efficiency and reduce costs without compromising quality. Our solutions, such as PCB Probe Stations, Load Pull systems, and tools for measuring Noise Parameters, are designed to streamline processes and enhance testing accuracy, offering cost-effective yet high-quality options to our clients.
Our division’s focus on these pillars, combined with our specialized products and services, positions MPI Corporation as a key player in the semiconductor testing market. We are dedicated to advancing the field with solutions that are not only innovative but also tailored to the specific needs of our clients, ensuring their success in a competitive and rapidly evolving industry.
Website: https://www.mpi-corporation.com/
Fraunhofer-Gesellschaft
Fraunhofer EMFT has more than 30 years of expertise in the field of electrostatic discharge (ESD) in microelectronics. Our expertise spans from resolving acute technical challenges and qualifying components with special requirements to developing robust ESD protection concepts for electronic circuits and systems.
With Capacitively Coupled Transmission Line Pulsing (CC-TLP), we have developed a more precise and reproducible CDM-like test method that shows excellent correlation with the
standardized CDM method in terms of stress current failure thresholds, electrical fault signatures, and physical damage signatures. In October 2022, CC-TLP was published by the
international ESD Association as a standardized method for ESD testing under ANSI/ESD SP5.3.4-2022.
We develop application-specific and customized ESD test equipment for our customers – especially for CDM and CC-TLP procedures. In close cooperation with our partners, we
implement complete, practical system solutions that can be seamlessly integrated into existing development and quality assurance processes.