High Power Pulse Instruments GmbH
Advanced TLP/HMM Solutions
HPPI GmbH 2011. All rights reserved.
TLP/VF-TLP/HMM Test System TLP-3010C/3011C
Pulse System TLP-3010C/3011C for the following applications fields:
- ESD robustness characterization on wafer-, chip- and board-level by TLP/vf-TLP/HMM pulse types
- Safe-Operating-Area (SOA) measurements of active and passive devices from 1 ns to 1.6 µs pulse width
- Reverse and forward recovery measurements of diodes from 200 ps to 1 µs
- Breakdown and turn on/off characteristics of devices
- Measurement of the impulse response
Features of the System
- Wafer and system level TLP/VF-TLP/HMM test system
- Ultra fast 50 Ω pulse output with 100 ps rise time
- Built-in HMM (IEC 61000-4-2) pulse up to ±8 kV
- High pulse output current up to ±30 A
- 6 programmable pulse rise-times: 100 ps to 45 ns
- 8 programmable pulse widths: 1 ns to 100 ns
- Optional pulse width extender increases pulse width up to 1.6 µs in 68 GPIB programmable steps
- Fast measurement time, typically 0.5 s per pulse including one-point DC measurement between pulses
- Efficient MATLAB®-based software (optional open source) for system control and waveform data management
Portable Wafer Probe Station PS-5026A
Features of the System
- Portable manual wafer probe station
- Electrically isolated chuck with vacuum interface and wafer backside potential connector
- 80x trinocular stereo zoom microscope
- Ultra long-life 20000 lx white LED ring light
- High reliability
- Low cost
Precision Micromanipulator Kit for TLP/VF-TLP Wafer-Level Measurements
PHD-3001A
Features of the System
- Pulse force and pulse sense RF probing solution for TLP/VF-TLP/HMM on-wafer measurements
- High peak current capability >50 A (30 ns)
- DC - 7 GHz bandwidth
- Isolated probe-head ground shield for high pulse sense common mode signal rejection
- True coaxial high-resolution 80:1 rotary probe-head for accurate probe tip adjustment